Advantages and Disadvantages of Thermal Silicone Film, Thermal Grease and Thermal Adhesive

Thermal conductivity of silicone film relative to the thermal grease and thermal double- sided adhesive has the following advantages:

1.Thermal conductivity range and stability

2.The structure of the difference between the work of the bridge to reduce the radiator and heat dissipation of the structural requirements of the workpiece

3.EMC, insulation performance

4.Shock the effect of sound absorption

5.Installation, testing, reusable convenience

6.Thermal conductivity range and stability

Thermal conductivity of silicone film in the thermal conductivity of the larger selectivity, from 0.8w / k.m 3.0w / k.m above, and stable performance, long-term use of reliable.

Thermal conductivity double-sided adhesive is currently the highest thermal conductivity of not more than 1.0w / k-m, the thermal effect is not ideal;

Thermal conductivity of silicone grease at room temperature curing process, in the high temperature conditions prone to dry surface, unstable performance, easy to volatilize and flow, thermal conductivity will gradually decline, is not conducive to long-term reliable system operation.

To bridge the structural process difference, reduce the radiator and heat dissipation of the structural parts of the work requirements

Thermal conductivity of silicone film thickness, hardness can be adjusted according to the design of the different, so in the thermal channel can be dispersed in the heat dissipation structure, chip size difference, reduce the structural design of the thermal device contact surface of the differential requirements, Flatness, roughness of the work difference, if the processing accuracy will improve the product cost to a large extent, so the thermal conductivity of silicone film can greatly increase the heating body and thermal device contact area, reducing the radiator production costs.

In addition to the traditional PC industry, now the new cooling solution is to remove the traditional radiator, the structural parts and radiators into a cooling structure. In the layout of the PCB layout will be scattered on the back of the chip layout, or in the front layout, the need for heat around the chip to open the hot hole, the heat through the copper foil and other lead to the back of the PCB, and then through the thermal silica chip to create a thermal conductivity guide to the PCB Bottom or side of the cooling structure metal bracket, metal shell), the overall cooling structure to optimize, but also reduce the cost of the entire cooling program.

EMC, insulation performance

Thermal conductivity of silicone film because of its material properties with thermal insulation properties, the EMC has a very good protection, the reasons for the silicone material is not easy to pierce and under pressure in the tear or damage, EMC reliability is better.

Thermal conductivity of double-sided rubber because of its material properties of its own restrictions, it is relatively low EMC protection performance, often fail to meet customer needs, when used in the more limited, generally only in the chip itself done insulation or chip surface made EMC protection Only when you can use.

Thermal grease because of the material properties of its own EMC protection performance is relatively low, many times fail to meet customer needs, in the use of more limited, generally only the chip itself done insulation or chip surface to do the EMC protection can be used.

Shock absorption sound effects

The silica gel carrier of the thermally conductive silicone film determines that there will be a good elasticity and compression ratio, so that it has a good cushioning effect, and then adjusting the density and the hardness can produce a good absorption effect on the low frequency electromagnetic noise.

The use of heat-conductive double-sided adhesive to determine the use of it does not have shock absorption sound-absorbing effect.

Thermal contact with the thermal grease to determine the use of it does not have shock absorption sound absorption effect.

Installation, testing, reusable convenience

Thermal silicone film for the stable solid, the plastic strength optional, easy to disassemble; flexible recovery, can be reused.

Thermal double-sided adhesive once used, not easy to disassemble, there is the risk of damage to the chip and the surrounding device, easy to disassemble thoroughly. In the scratch thoroughly, it will scratch the surface of the chip and pick up when the dust, oil and other interference factors, is not conducive to thermal conductivity and reliable protection.

Thermal grease can not be disassembled, must be carefully wiped swab, it is not easy to wipe thoroughly, especially in the replacement of thermal conductivity test, the reliability of the test data will have an impact, thus affecting the engineer's judgment.