Time: 2017-04-24 From: The world of electronic products

TDK Group has recently introduced a new ultra-thin ceramic substrate CeraPad ?, which uses multi-layer structure design, and in which integrated ESD protection, without the need for other independent ESD components. This innovative substrate can meet the needs of the ultimate miniaturization, and also has the best ESD protection, so in the sensitive application can achieve maximum integration of ESD protection.

CeraPad ceramic substrate ESD protection capacity of up to 25 kV,and the most advanced Zener diode standard protection capacity of only 8 kV, CeraPad ceramic substrate ESD protection capability is better than traditional products 3 times. In addition, this ceramic substrate thickness of only 300 μm to 400 μm, but with up to 22 W / mK thermal conductivity, but also more than three times the traditional carrier. The CeraPad contact pads can be designed according to the requirements of the welding process. Applicable to standard SAC (Sn / Ag / Cu, 260C) reflow or eutectic (AuSn, 320C) process.

In the unit LED number and density growing today, this new technology is particularly suitable for a variety of LED applications. The CeraPad reduces the standard LED component custom chip specification package (CSP) from CSP1515 to CSP0707. In addition, CeraPad also has a very low coefficient of thermal expansion (6 ppm / mK), and LED lighting thermal expansion coefficient is almost the same. Therefore, when the temperature changes, the substrate and the LED between almost no mechanical stress.

Similar to the PCB board, the CeraPad ceramic substrate multilayer technology can also be through the perforation of the internal re-distribution of each layer connected to the design of some kind of integrated circuit. In general, today's matrix LEDs contain multiple series LEDs. In contrast, the new CeraPad module for the first time to achieve a new type of LED array, in this LED array, hundreds of LED light source can be independently controlled. Application designers will be able to use this technology to create innovative, high-resolution and safe lighting effects in the smallest space, such as multi-LED lighting flash on smartphones or adaptive headlamps for cars.

With CeraPad ceramic substrates, the TDK Group is able to offer customers an attractive custom packaging solution that will enable them to better meet the challenges of rising IC sensitivity in the future, enabling customers to take advantage of a completely new approach Lighting design, and also improve the LED lighting efficiency.

Main application

1. Automotive headlights and smartphone flash LED system

2. Car ECU, smartphone and tablet PC

Main features and advantages

1.Integrated ESD protection in multi-layer substrates

2. ESD protection up to 25 kV

3. Thermal conductivity up to 22 W / mW

4. Ultra-thin thickness from 300 μm to 400 μm